| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for mounting electronic component which can surely conduct suction and removal of electronic components from a component accommodating section at a joint portion, even when accommodated tapes are connected by means of a splicing tape, making the suction rate of electronic components not to decrease. <P>SOLUTION: CPU110 transmits a feed command to a component supply unit and makes the component supply unit execute the component feed operation. Thereafter, when a joint of accommodated tapes is detected by a joint-detecting device, image of an accommodating section for old accommodated tapes older than the joint is taken, by moving a substrate recognizing camera 17 to a suction and removal position of the supply unit by an X-axis drive motor 12X and a Y-axis drive motor 12Y; and a recognition processing device 117 executes the recognition process. Based on the recognition process result, a correction value is stored in RAM111, and a suction nozzle is moved, taking into consideration the correction value and is lowered, to remove an electronic component. <P>COPYRIGHT: (C)2010,JPO&INPIT |
