INTERMETALLIC COMPOUND FILLED VIAS

摘要

Electronic devices including intermetallic columns within vias are provided. Vias are filled with one or more pastes containing metal particles. Thermal treatment of the pastes within the vias converts the particles within the pastes to one or more intermetallic compounds that do not melt during next level packaging.

主权项

1. An electronic device comprising:
a wafer; a plurality of vias within the wafer, and a plurality of electrically conductive columns filling the vias, each of the columns consisting essentially of one or more intermetallic compounds, the intermetallic compounds comprising at least one of tin and indium.