| 摘要 |
PROBLEM TO BE SOLVED: To prevent the degradation of performance after underfilling by providing a vertical transmission structure for high frequency transmission lines to protect vertical transmission between connectors with a coaxial structure. SOLUTION: A signal line 15 on a substrate and a peripheral grounding part 13 are insulated and are grounded at intervals. In the same manner, a grounding part 23 and a signal line 231 on a chip are insulated and are grounded at intervals. The signal line 15 on the substrate connects the signal line 231 of the chip by contact of a second conductive connection structure and transmission of fourth conductive connection structures 253a and 253b, to form a transmission structure. The vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core, for the substrate and a flip chip. The vertical transmission structure is applied to a high-frequency flip chip package for reducing an influence of underfilling. COPYRIGHT: (C)2010,JPO&INPIT |
