| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board capable of efficiently disposing a number of patterns for inspection, and capable of miniaturizing a product. <P>SOLUTION: In the wiring board 1, a wiring structure, which comprises vias 11, 12, 13 (lower, internal, and upper conductors each) and conductor patterns M1, M2, M3, M4, is formed on a multilayer board 20 in which a plurality of insulating layers formed by resin, or the like are stacked. The conductor patterns M1, M2, M3, M4 are provided in layers L1, L2, L3, L4 of the multilayer board 20, respectively. The vias 11, 12, 13 are coaxially provided between the layers L1, L2, the layers L2, L3, and the layers L3, L4, respectively. A columnar conductor 10 is composed of the vias 11, 12, 13. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
