| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film deposition apparatus capable of enhancing the film deposition quality by improving the temperature distribution in a film-deposited substrate. Ž<P>SOLUTION: In a process of performing the film deposition by tightly fitting a mask 4 to a film deposition surface of a substrate 1, the temperature control of the substrate 1 is performed by tightly fitting a back side cooling member 3 to a non-film deposition surface side of the substrate 1. When a center part of the substrate 1 is opposite to an evaporation source, and higher in temperature than a peripheral part, a projecting part 3a having a large contact area with the substrate 1 is provided on a center part of the back side cooling member 3. Thus, the cooling efficiency of the back side cooling member 3 is distributed to improve the temperature distribution of the substrate 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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