| 摘要 |
PURPOSE: A system, a device, and a method for manufacturing a light emitting diode are provided to improve productivity by manufacturing a light emitting diode module by packaging a circuit board with the light emitting diode and a plurality of injection flow hole. CONSTITUTION: A manufacturing device(10) of a light emitting diode module includes a lower mold(30), an upper mold, and an injection supply unit. The lower mold has at least one pair of lower cavities in which a circuit board is positioned. The upper mold is closely adhered to and separated from the lower mold vertically. The upper mold includes a pair of upper cavities, an injection hole, and a hot runner. The pair of upper cavities correspond to the pair of lower cavities. The injection hole is positioned between the pair of upper cavities. The hot runner connects the injection hole and each upper cavity. An injection supply unit supplies the injection object to the injection hole in an upper side of the upper mold. The injection object is supplied to the upper cavity through the resin injection hole and the hot runner. The injection object is supplied to the lower cavity through the injection flow hole. |
