Microelectromechanical component and manufacturing method for microelectromechanical components

摘要

An MEMS component includes: a substrate into which a cavity is structured from a functional top side; a buried polysilicon layer in which a polysilicon diaphragm which at least partially spans the cavity is exposed as the first electrode; an epi-polysilicon layer in which a conductive structure, which is situated at a distance above the polysilicon diaphragm by a clearance, is exposed as the second electrode; and an access opening which fluidically connects the external surroundings of the MEMS component to the cavity. At least one access channel is formed in at least one of the buried polysilicon layer, the epi-polysilicon layer, and an inner wall of the cavity of the substrate which connects the access opening to the cavity, and whose channel width is not greater than 5 μm.

主权项

1. A MEMS component, comprising:
a substrate having a cavity structured from a functional top side of the substrate; a buried polysilicon layer in which a polysilicon diaphragm, which at least partially spans the cavity, is exposed as a first electrode; an epi-polysilicon layer in which a conductive structure, which is situated at a distance above the polysilicon diaphragm by a predetermined clearance, is exposed as a second electrode; and an access opening which fluidically connects the external surroundings of the MEMS component to the cavity, wherein at least one access channel is formed in at least one of the buried polysilicon layer, the epi-polysilicon layer, and an inner wall of the cavity of the substrate, wherein the at least one access channel connects the access opening to the cavity, and wherein channel width of the at least one access channel is not greater than 5 μm, and wherein the at least one access channel has an aspect ratio of at least 1:4.