| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device that can be miniaturized further by reducing the area of a product while securing a product area, and has superior heat radiation characteristics. <P>SOLUTION: In a substrate 1 having a built-in semiconductor, a semiconductor device 10 is mounted while being buried in a substrate 20, namely a laminate of a plurality of insulating layers. The semiconductor device 10 has inspection electrodes Ea, Eb for resistance measurement evaluation. The inspection electrodes Ea, Eb conduct electricity mutually, and are not terminated. More specifically, the inspection electrodes Ea, Eb are not connected to conductor layers 30, 32, 34, and are buried in the substrate 20 while the inspection electrodes Ea, Eb are isolated electrically. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
