Elektronische Leistungspackung mit zwei Substraten mit mehreren Halbleiterchips und elektronischen Komponenten

摘要

The package has two non-planar insulating substrates with high thermal conductivity with electrical conductivity layers (7a, 7b, 8a, 8b, 9a, 9b, 9c), which are alternatively stacked. An arrangement of raised regions or posts and a shape of the raised regions or posts are adjusted in such a manner that a mechanical separation is provided between the two non-planar insulating substrates with high thermal conductivity. The electrical conductivity layers are separated and isolated from each other.