| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroplating device capable of increasing the supply of a plating liquid to the surface of a substrate to cope with high current density and obtaining thick and uniform plating film thickness in a short time. Ž<P>SOLUTION: The electroplating device is equipped with a plating bath comprising an adsorption plate 10 and a plating bath body 50, an anode 30 immersed in the plating liquid, a semiconductor substrate W mounted at a position opposed to the surface of the anode 30 immersed in the plating liquid, a power source device 80 for supplying current between the semiconductor substrate W and the anode 30 and pipes 61-1, 2, 73-1 to 6 for supplying the plating liquid to the plating bath. A diaphragm 70 for separating the plating liquid in the semiconductor substrate W side and the plating liquid in the anode 30 side from each other is provided between the semiconductor substrate W and the anode 30. The plating liquid in parallel to the surface of the semiconductor substrate W is passed between the diaphragm 70 and the semiconductor substrate W by the plating pipes 73-1 to 6. An uneven shape (V-shaped groove 71) is formed on the surface of the diaphragm 70 opposed to the semiconductor substrate W. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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