Variable frequency drive heat sink assembly

摘要

A heat sink assembly is disclosed for cooling a power electronics module, such as a variable frequency drive. The heat sink assembly includes a housing and a heat sink structure. The housing defines an interior chamber for enclosing the power electronics module and also defines a cooling air flow channel exterior to the interior chamber. The heat sink structure is disposed in conductive heat transfer relationship with the interior chamber and has a heat transfer surface positioned within the exterior cooling air flow channel in convective heat transfer relationship with the cooling air flow.

主权项

1. A heat sink assembly for cooling a power electronics module comprising:
a housing defining an interior chamber for enclosing the power electronics module and defining a flow channel exterior to said interior chamber; and a heat sink structure disposed in conductive heat transfer relationship with said interior chamber and having a heat transfer surface positioned within the exterior flow channel; wherein the heat transfer surface comprises a plurality of external heat transfer fins extending outwardly from said housing into the flow channel of the housing; wherein the plurality of external heat transfer fins have an arcuate contour in longitudinal expanse.