SEMICONDUCTOR PACKAGING MATERIAL INCORPORATING SILICON DIOXIDE FILLER

摘要

PURPOSE: An adhesive composition for semiconductor packaging is provided to reduce the loss of reliability and adhesion and to improve a packaging processability by reducing the deviation of thermal expansion coefficient which occurs between a support member of a semiconductor chip and a stacked member such as a chip. CONSTITUTION: An adhesive composition for semiconductor packaging comprises a base resin 100.0 parts by weight, an inorganic filler 5~30 parts by weight consisting of titanium dioxide and at least one kind of metal oxides, a hardener, and an initiator. The base resin comprises a rubber resin 15-30 parts by weight with an average molecular weight of 50,000 or greater, a rubber modified epoxy 10~35 parts by weight, and general epoxy 10~50 parts by weight. The inorganic filler comprises silicon dioxide 50~80 weight% and titanium dioxide 20~50 weight%.