| 摘要 |
FIELD: physics. ^ SUBSTANCE: thin-film light-emitting diode semiconductor device, designed for assembling using surface mounting technique, has a substrate with an electroluminescent layer on top, having contacts and a control microcircuit, contacts of which are connected to contacts of the electroluminescent layer with formation of connection terminals. The control microcircuit lies inside the substrate at the side which is opposite the side with the electroluminescent layer. Contacts of the microcircuit and the electroluminescent layer are connected through at least one vertical opening, made in the substrate, consisting of a silicon layer on sapphire. The control microcircuit lies inside the silicon layer, the electroluminescent layer lies on the reverse side on sapphire, between sapphire and the electroluminescent layer there is an indium oxide layer, and connection terminals serve for surface mounting of the device. ^ EFFECT: design of a device for displaying information with large area of the outer surface. ^ 1 dwg |
