| 发明名称 |
ELECTRONIC-COMPONENT COOLING DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact water-cooled electronic-component cooling device. <P>SOLUTION: The electronic-component cooling device is constituted of a so-called water-cooled heat sink 3, a radiator 7 cooled by an electric fan 5, a first and a second refrigerant channels 9, 11 to circulate the refrigerant in between the heat sink 3 and the radiator 7, and an electric pump 13 to feed a moving energy to the refrigerant. The electric pump 13 is disposed in face to face with the dissipating unit of the radiator 7. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2009260371(A) |
申请公布日期 |
2009.11.05 |
| 申请号 |
JP20090173529 |
申请日期 |
2009.07.24 |
| 申请人 |
SANYO DENKI CO LTD;INTEL CORP |
发明人 |
IKEDA TOMOAKI;MIYAZAWA MASATSUGU;IIJIMA MASAYUKI;UENO KOJI;GWIN PAUL J;LONG BRIAN J;DAVISON PETER A;KONSTAD ROLF A |
| 分类号 |
H05K7/20;H01L23/467;H01L23/473 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
