| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermoelectric module whose temperature detection accuracy further improves. <P>SOLUTION: The thermoelectric module is provided with: a first substrate 11; a plurality of thermoelectric elements arranged on a first surface 111 of the first substrate 11; and a temperature detection element (chip thermistor 13) arranged on the first surface 111 or a second surface 112 of the first substrate 11 via a thermally conductive member 19. Thermal conductivity improves since temperature of the first substrate 11 becomes easy to be transmitted to the chip thermistor 13 by this structure. As a result, temperature control with high accuracy becomes possible. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
