发明名称 CHIP TYPE SOLID ELECTROLYTIC CAPACITOR, AND ITS METHOD FOR MANUFACTURING
摘要 PROBLEM TO BE SOLVED: To provide a board-mounted type chip type solid electrolytic capacitor stabilized in connection between a capacitor element and a printed board; and its method for manufacturing. SOLUTION: In this chip type solid electrolytic capacitor, a capacitor element 1 with a positive electrode lead led out therefrom is mounted on a printed circuit board 7 provided, on the upper surface, with an internal positive electrode terminal 5a and an internal negative electrode terminal 6a, and provided, on the lower surface, with an external positive electrode terminal 5b electrically connected to the internal positive electrode terminal 5a through a positive electrode through-hole 5c, and an external negative electrode terminal 6b electrically connected to the internal negative electrode terminal 6a through a negative electrode through-hole 6c, and the capacitor element is covered with an armoring resin. In the chip type solid electrolytic capacitor, an armoring resin is filled in an inter-terminal through-hole 8 between the internal positive electrode terminal 5a and the internal negative electrode terminal 6a of the printed circuit board 7. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009260207(A) 申请公布日期 2009.11.05
申请号 JP20080191628 申请日期 2008.07.25
申请人 NEC TOKIN CORP 发明人 TANAKA YOSHIHIKO
分类号 H01G9/004;H01G9/00;H01G9/08 主分类号 H01G9/004
代理机构 代理人
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