| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in fluidity, adhesiveness, dimensional stability and low stress property, and to provide an electronic component device having an element sealed by the composition. Ž<P>SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) a curing agent and (C) a silicone compound expressed by a predetermined chemical formula having Si-OH at both ends, wherein the (C) silicone compound has a peak value Mp in the molecular weight of not less than 3,000 and has a proportion of not less than 15% of molecules having a molecular weight of not more than 1,000. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
