| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability in connection between a top surface of a metal bump of a wiring circuit board using the metal bump as an interlayer connection means and a wiring layer connected thereto, to improve an yield of the wiring circuit board, and further to improve electrical characteristics by enhancing an insulating part between wiring layers or between wiring circuit boards. <P>SOLUTION: In the wiring circuit board, the top surface of a metal bump 28 and a wiring film 10 (16) connected thereto are connected by the direct metal bonding of metals, for example, copper-to-copper bonding. Furthermore, air or a foamed resin 12 containing air is used as an interlayer insulating film. Thus, reliability in the connection between the top surface of the metal bump and the wiring layer is improved, and the yield of the wiring circuit board can be enhanced. When interlayer insulation is implemented by using air or the foamed resin, the dielectric constant of an interlayer insulator is reduced to lower the parasitic capacitance of the wiring circuit board or an electronic circuit using the wiring board, thereby improving circuit characteristics and performance. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
