| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sputtering cathode capable of solving any economical problem and efficiently and simultaneously depositing uniform films on a surface of an object to be film-deposited without increasing and complicating a sputtering apparatus, and a sputtering apparatus using the same. Ž<P>SOLUTION: The sputtering cathode 11 includes a pair of ring-shaped magnets 12A, 12B with their polarities different from each other, a ring-shaped sputtering target 15, a magnetic yoke 16, a cooling jacket 14, and a graphite sheet 17. The sputtering cathode 11 is installed in a sputtering apparatus. While the ring-shaped sputtering target 15 is stored therein, an object to be film-deposited is fixed inside the sputtering target 15, or moved in the axial direction of the ring at a predetermined speed to execute the film deposition on the object. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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