| 摘要 |
<P>PROBLEM TO BE SOLVED: To inexpensively provide a heat-dissipating structure, having improved heat conductivity, high heat radiation performance, and improved moisture resistance. Ž<P>SOLUTION: In the heat dissipation structure, at least one portion of the surface of a substrate has an aluminum oxide phase and an alumina whisker is formed on the aluminum oxide phase. In particular, the substrate is made of aluminum, the alumina whisker is formed, while being extended to the outside from the surface to form a layer; and preferably, the surface of the substrate has an alumina whisker layer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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