| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the size of a semiconductor element mountable on a wiring board having a tilting part, in a semiconductor package provided with a tilting part at ends of a wiring board and a sealing resin layer. <P>SOLUTION: The semiconductor package constituting a memory card 1 includes semiconductor elements such as a memory element 13 mounted on an element mounting part 10 of a wiring board 2. The memory element 13 and the like are sealed by a sealing resin layer 6 formed on the wiring board 2. The tilting part 7 is formed at ends of the wiring board 2 and the sealing resin layer 6 from a first principal surface 2a of the wiring board 2 to the sealing resin layer 6. The memory element 13 is arranged on the wiring board 2 through a dummy element 16 so that its end projects from the end of the wiring board 2 and positioned above the tilting part 7. <P>COPYRIGHT: (C)2010,JPO&INPIT |
