发明名称 METHOD OF FABRICATING A DEVICE WITH FLEXIBLE SUBSTRATE AND METHOD FOR STRIPPING FLEXIBLE-SUBSTRATE
摘要 A method for fabricating a device with a flexible substrate includes providing a rigid substrate at first. Next, an interfacing layer can be formed on the rigid substrate, and then a flexible substrate is directly formed on the interfacing layer. The flexible substrate fully contacts the interfacing layer. A device structure is then formed on the flexible substrate.
申请公布号 US2009271981(A1) 申请公布日期 2009.11.05
申请号 US20090497297 申请日期 2009.07.02
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 HU TAMG-SHIANG;YAN JING-YI;HO JIA-CHONG;LEE CHENG-CHUNG
分类号 B21D39/00 主分类号 B21D39/00
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