发明名称 |
METHOD OF FABRICATING A DEVICE WITH FLEXIBLE SUBSTRATE AND METHOD FOR STRIPPING FLEXIBLE-SUBSTRATE |
摘要 |
A method for fabricating a device with a flexible substrate includes providing a rigid substrate at first. Next, an interfacing layer can be formed on the rigid substrate, and then a flexible substrate is directly formed on the interfacing layer. The flexible substrate fully contacts the interfacing layer. A device structure is then formed on the flexible substrate.
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申请公布号 |
US2009271981(A1) |
申请公布日期 |
2009.11.05 |
申请号 |
US20090497297 |
申请日期 |
2009.07.02 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HU TAMG-SHIANG;YAN JING-YI;HO JIA-CHONG;LEE CHENG-CHUNG |
分类号 |
B21D39/00 |
主分类号 |
B21D39/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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