| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve productive efficiency of a die by reducing excessive local polishing and polishing a large number of substrates on a single polishing pad. <P>SOLUTION: This carrier head 200 to polish the substrate 12 is furnished with: a body 204 having a wall extending downward and to partition a cavity 210; a sleeve 220 provided on a lower end of the wall extending downward; and a member 214 with elasticity to form a pressure chamber in the cavity 210. The member 214 with elasticity has: an inner surface to make contact with fluid in the chamber; a part to make a substrate reception surface to make contact with a back surface of the substrate 12; and a part to make contact with an internal wall of the cavity 210. <P>COPYRIGHT: (C)2010,JPO&INPIT |
