发明名称 COOLING DEVICE OF MOBILE ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To suppress thermal fatigue breakdown of heat generating electronic components by a heat cycle in starting an engine. Ž<P>SOLUTION: A cooling device 21 of a mobile electronic apparatus is provided with an engine cooling route 2 and an electronic component cooling route 3, and the electronic component 31 loaded into an automobile is cooled with the common coolant. A valve 16 for opening and closing the route 3 is provided to the electronic component cooling route 3 for guiding the coolant to a liquid cooling type cooling part 12 of a heat sink 14 of the electronic component 31. The valve 16 closes the electronic component cooling route 3 when the temperature of the heat sink 14 of the electronic component 31 is lower than the setting value and opens the route 3 when the temperature becomes higher than the setting value. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009260113(A) 申请公布日期 2009.11.05
申请号 JP20080108712 申请日期 2008.04.18
申请人 MEIDENSHA CORP 发明人 KAKEBAYASHI TOORU;YAMAGUCHI TAKASHI
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
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