ADHESIVE COMPOSITION, ADHESIVE FOR CIRCUIT CONNECTION AND CONNECTED PRODUCT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition which ensures sufficient adhesiveness and connection reliability even when the composition is cured at a low temperature in a short time, and to provide an adhesive for circuit connection and a connected product, using the same. SOLUTION: The adhesive composition contains: (a) a thermoplastic resin; (b) a radical polymerizable compound having at least two (meth)acryloyl groups in the molecule; (c) a radical polymerization initiator; and (d) a silane coupling agent having a urethane bond and an alkoxysilyl group in the molecule. COPYRIGHT: (C)2010,JPO&INPIT