摘要 |
The present invention discloses a liquid cooling heat dissipating device for at least one heat source. The liquid cooling heat dissipating device comprises a base, at least a cooling fin and a liquid cooling module. The device is characterized in that the cooling fin is disposed on the first area of surface of the base, and the liquid cooling module is removably installed on the first area of surface of the base. By this way, the users can optionally install the liquid cooling module according to the degrees of the generated heat. Computer suppliers can also reduce the cost effectively.
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