| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To predict an initial reliability of a semiconductor product before layout of a semiconductor product is designed. <P>SOLUTION: A method of predicting the reliability of a semiconductor device includes: calculating the defect density of a plurality of wiring patterns on a wafer; extracting the critical area of a series of library elements formed of wiring patterns based on the defect density to determine the critical area value of each library element; determining a failure probability by wiring pattern from the result of a reliability test of the wiring pattern to form a correlation model from an expected value in which a defect is generated and which is obtained from the defect density and the failure probability of each wiring pattern; calculating the failure probability of each library element from the critical area value and the function of the correlation model; designing a layout of a semiconductor product by combining two library elements or more out of a series of the library elements and calculating the reliability of the designed semiconductor device by considering the failure probability of each of the library elements. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
