| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a stage device providing high parallelism between a loading substrate and other substrate to which the former substrate is to be bonded, and to provide a control method thereof. <P>SOLUTION: The stage device 34 includes a wafer table 36 for holding a lower substrate Wd, a tilt table 38 where the wafer table 36 is mounted, first to third load cells 40, 42, 44 which are provided between the tilt table 38 and wafer table 36 and detect a load input through the wafer table 36, and a support table 45 which supports the tilt table 38. The tilt table 38 is tilted on the support table 45 by first and second driving mechanisms 46 and 48 so that detected values LC1, LC2, LC3 of the first to the third load cells 40, 42, 44 become equal to one another. Consequently, high parallelism of the substrate is obtained by adjusting the tilt. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
