| 摘要 |
<p>Provided is an inspection device (1) in which a CPU (43) directs a DMD element (31) (micromirror) in one direction, determines the part of a Fourier image which is appropriate for inspection based on brightness information obtained by detection using a Fourier image imaging element (33), and controls the DMD element (31) (micromirror) corresponding to the part appropriate for inspection to be directed in the other direction. An inspection imaging element (35) images the surface of a wafer (W) when the DMD element (31) (micromirror) corresponding to the part appropriate for inspection is directed in the other direction.</p> |
