| 摘要 |
PURPOSE: An LED module and an LED lamp using the same are provided to minimize a property change of a part by efficiently emitting a heat of a PCB through a thermally conductive adhesive. CONSTITUTION: An LED module includes a heat dissipation plate, a PCB, and a plurality of LED chips(10). A plurality of heat dissipation fins(82) is formed on one surface of the heat dissipation plate. The PCB is attached to the other surface of the heat dissipation plate by a thermally conductive adhesive(70). Wiring patterns(52,62) are formed on the PCB. The LED chips are soldered on the PCB in order to be connected to the wiring patterns of the PCB. A silicon(20) is coated on a top surface of the LED chip in order to expand a radiation angle of the LED chip.
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