<p>The system has a cooling body for taking up heat from a surface mountable power component to a printed circuit board unit. The cooling body has a region for liquid cooling and a region for air cooling for delivering the heat to a gaseous or liquid medium. The region for liquid cooling has a channel (9), and the region for air cooling has a cooling body profile. The liquid medium exhibits a cooling dielectric of a machine tool i.e. spark erosion machine tool. Cooling tubes (10) are thin-walled and arranged in the channel such that the tubes are adjusted by elastic deformation of the channel. An independent claim is also included for a method for cooling a printed circuit board unit for a machine tool.</p>
