发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PREPARING HEAT-RESISTANT RESIN FILM |
摘要 |
The present invention is directed to a photosensitive resin composition comprising (a) a resin having a specific structure, (b) a photosensitive agent, and (c) an organic solvent having a boiling point at atmospheric pressure of 100 DEG C or higher and 140 DEG C or lower, the content of the component (c) being 50% by weight or more and 100% by weight or less based on the total amount of the organic solvent, and to a process for producing a heat-resistant resin film using the same. According to the present invention, there is provided a photosensitive resin composition which is less likely to cause defects such as transcribed trace and line drawing. <IMAGE> |
申请公布号 |
EP1508837(A4) |
申请公布日期 |
2009.11.04 |
申请号 |
EP20030733112 |
申请日期 |
2003.05.28 |
申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
MIYOSHI, KAZUTO;OKUDA, RYOJI;TOMIKAWA, MASAO |
分类号 |
G03F7/037;G03F7/004;G03F7/022;G03F7/023;H01L27/32;H01L51/52;H05B33/10;H05B33/14 |
主分类号 |
G03F7/037 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|