| 摘要 |
PURPOSE: A semiconductor manufacturing apparatus is provided to prevent the side exposure of the heater thermal by blocking heat of the heater using a side cover. CONSTITUTION: The wafer carrier(130) includes the upper plate which includes the pocket within the chamber(110) and the side cover extended to the upper plate. The heater(140) is arranged under the upper plate of the wafer carrier. The supporting part(160) is combined with the side cover for the rotation of the wafer carrier. The knob performs loading or unloading on the wafer carrier. The side cover of the wafer carrier is formed of cylindrical type. The rotating unit(170) of cylindrical type is combined with the supporting part.
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