| 摘要 |
PURPOSE: A thermosetting poly-imide composition is provided to ensure good adhesion strength with a flexible board at a thermal treatment of 200 °C or less, and to secure excellent electric characteristic, dimensional stability, chemical resistance, and mechanical characteristic of a film. CONSTITUTION: A soluble poly-imide comprises 10~80 mol% of polysiloxane diamine represented by chemical formula 1 based on the total amine and has an aryl group at the end thereof. In formula 1, a is an integer of 1-10, b is an integer of 5-15m and R1 is a methyl group. The thermosetting composition is obtained by adding 5~100.0 parts by mass of a compound with aryl or acrylate group based on 100 parts by mass of non-volatile portion of the soluble poly-imide.
|
