发明名称 |
Integrated circuit package with chip-side signal connections |
摘要 |
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
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申请公布号 |
US7611924(B2) |
申请公布日期 |
2009.11.03 |
申请号 |
US20080015985 |
申请日期 |
2008.01.17 |
申请人 |
INTEL CORPORATION |
发明人 |
KIM JOONG-HO;HAN DONG-HO;KIM HYUNJUN;HE JIANGQI |
分类号 |
H01L21/00;H01L21/60;H01L23/02;H01L23/498;H01L23/538;H01L23/552;H05K1/14 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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