发明名称 |
Electronic device having wiring substrate and lead frame |
摘要 |
An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.
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申请公布号 |
US7612434(B2) |
申请公布日期 |
2009.11.03 |
申请号 |
US20070976503 |
申请日期 |
2007.10.25 |
申请人 |
DENSO CORPORATION |
发明人 |
IMAIZUMI NORIHISA;SANADA YUUKI;ISHIKAWA TAKESHI |
分类号 |
H01L23/495;H01L25/00;H01L23/02;H01L23/498;H01L25/065;H01L25/16;H01L29/06 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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