| 摘要 |
38 WIRE BONDING APPARATUS ABSTRACT A WIRE BONDING APPARATUS FOR CONNECTING AN ELECTRODE OF A SEMICONDUCTOR CHIP (43) TO A LEAD OF A LEAD FRAME USING A WIRE OR BONDING A BUMP TO A PAD OF A 5 SEMICONDUCTOR CHIP COMPRISES DC PULSE APPLYING MEANS FOR APPLYING DC PULSE TO HE WIRE OR THE BUMP, DETECTION MEANS FOR DETECTING A RESPONSE WAVEFORM FROM THE WIRE OR THE BUMP APPLIED WITH THE DC PULSE, AND DISCRIMINATION MEANS FOR DISCRIMINATING WHETHER OR NOT THE WIRE OR THE 10 BUMO IS SUCCESSFULLY BONDING-CONNECTED BY COMPARING THE RESPONSE WAVEFORM WITH AN UNSUCCESSFUL BONDING RESPONSE WAVEFORM OBTAINED BY APPLYING THE DC PULSE TO AN UNSUCCESSFULLY BONDED WIRE OR BUMP. 15 |
