| 摘要 |
A backplate for heat radiator is configured to mount to a rear side of a motherboard, and is provided at predetermined positions with an insulating bonding material. The insulating bonding material not only firmly connects the backplate to the rear side of the motherboard, but also serves as an insulating means between the metal backplate and the motherboard. That is, with the insulating bonding material, the backplate would not separate from the motherboard when the motherboard is moved, and the motherboard is electrically insulated from the backplate.
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