| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem, wherein interpolation calculation between pixels for position alignment requires time and a problem wherein size calculation and classification of a defect cannot be performed with sufficient accuracy, because the number of sampling points run short, in an inspection apparatus for extracting the defects from a difference image between a defective image and a reference image. SOLUTION: A two-dimensional sensor 3 is installed, inclining at a predetermined angle with respect to a moving direction of a stage 1, on which an object to be inspected is mounted and, in synchronism with the movement of the stage 1, a picked up image is rearranged so that there can be obtained an image in high-density sampling with a pixel size or less of the two-dimensional sensor 3 with respect to a wafer 2. Thus, interpolation calculation during position alignment becomes unnecessary, and size calculation and classification of a defect can be performed with high accuracy. COPYRIGHT: (C)2010,JPO&INPIT
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