发明名称 |
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
The electronic circuit device of the present invention includes at least one semiconductor element, a plurality of external connection terminals, a connecting conductor for electrically connecting semiconductor element and external connection terminals, and an insulating resin for covering the semiconductor element and supporting the connecting conductor integrally, in which the semiconductor element is buried in the insulating resin, and the terminal surface of the external connection terminals is exposed from the insulating resin.
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申请公布号 |
US2009267214(A1) |
申请公布日期 |
2009.10.29 |
申请号 |
US20060066534 |
申请日期 |
2006.10.19 |
申请人 |
KUMAZAWA KENTARO;KONDOU SHIGERU;NISHIKAWA HIDENOBU |
发明人 |
KUMAZAWA KENTARO;KONDOU SHIGERU;NISHIKAWA HIDENOBU |
分类号 |
H01L25/065;H01L21/56;H01L23/12;H01L23/52;H01L25/07 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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