| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the wear of the retainer ring of a polishing device. <P>SOLUTION: The retainer ring 11 comprises a retainer ring external section 22, a retainer ring internal section 24, a connection part 23, and balls 21. The retainer ring 11 is brought into point contact with a polishing pad 3 through the balls 21. A fitting hole 31 and a gap 32 are formed in the internal part 24. The retainer ring is fixed by an upper plate 13, and the left end thereof is brought into contact with a wafer 5 and a membrane 12. The internal part 24 is separated from the polishing pad 3, and holds the wafer 5. A fitting hole 31 and a gap 25 are formed in the external part 22. The upper part of the retainer ring is brought into contact with the upper plate 13, and the left end thereof is brought into contact with the internal part 22. The external part 22 is separated from the polishing pad 3, and formed integrally with the internal part 24 by fitting the connection part 23 into the fitting hole 31. The balls 21 are harder than the polishing pad 3, and assembled in the gap 25 and the gap 32. <P>COPYRIGHT: (C)2010,JPO&INPIT |
