| 摘要 |
<p>Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure 70 includes a seal 78 with a chemically reactive getter. Another embodiment of a MEMS device package 800 comprises a primary seal 805 with a getter, and a secondary seal 804 proximate an outer periphery of the primary seal 805. Yet another embodiment of a MEMS device package 900 comprises a getter 902 positioned inside the MEMS device package 900 and proximate an inner periphery 903 of the package seal 78.</p> |
