| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a workpiece substrate from being not machined as planned because of stains adhered to the workpiece substrate and flaws, bubbles or striae in the workpiece board, and securely machine the workpiece substrate. <P>SOLUTION: A laser machining device machines the workpiece substrate 60 having a transparent substrate 61 and a thin film 62 arranged at the transparent substrate 61. The laser machining device includes a holding part 30 for holding the workpiece substrate 60 and a laser oscillation part for irradiating the workpiece substrate 60 held by the holding part with a laser beam L. The laser beam L irradiated from the laser oscillation part 1 is made to be incidentable on the workpiece substrate 60 through two optical paths and at least laser beams L, L1, La, L2, and Lb are made to be incidentable on the thin film 62 from the transparent substrate 60 side. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
