| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a plurality of semiconductor elements stacked, wherein high speed operation of the semiconductor elements is attained. <P>SOLUTION: The semiconductor device is provided with semiconductor packages 2 and 3, and a spacer 201. The semiconductor packages 2 and 3 are stacked through the spacer 201 interposed therebetween. The semiconductor packages 2 and 3 have, respectively, package boards 101 and 111, and semiconductor elements 102 and 112 mounted on the package boards 101 and 111. The spacer 201 has a plurality of conductive vias 204 and a capacitor element 202. The semiconductor packages 2 and 3 are electrically connected through the conductive vias 204. The capacitor element 202 is electrically connected, among the conductive vias 204, to a conductive via that electrically connects the semiconductor element 112 and power supply, and a conductive via that electrically connects the semiconductor element 112 and ground. <P>COPYRIGHT: (C)2010,JPO&INPIT |
