发明名称 PROTECTIVE ELEMENT AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>Provided is a protective element which can be applied to reflow mounting and can ensure good responsiveness to current interruption operation even if the liquid phase point or the solid phase point of solder used is higher than a mounting temperature. A protective element wherein a resilient member (20) is bonded through solder (21) to a second conductor (15) and conduction electrode terminals (16, 17) formed on a predetermined substrate (11) in order to divide a conduction passage into a plurality of current interruption parts. The solder (21) has a liquid phase point higher than the mounting temperature when the protective element is mounted on a protection object apparatus. The resilient member (20) is soldered to the second conductor (15) and the conduction electrode terminals (16, 17) while holding stress of such a degree as the resilient member is separated from at least one of the second conductor (15) and the conduction electrode terminals (16, 17) by being deformed even under such a state where the solder (21) does not melt completely.</p>
申请公布号 WO2009130946(A1) 申请公布日期 2009.10.29
申请号 WO2009JP53870 申请日期 2009.03.02
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION;YONEDA, YOSHIHIRO 发明人 YONEDA, YOSHIHIRO
分类号 H01H37/76;H01H69/02;H01H85/06 主分类号 H01H37/76
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