| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet peeling device adhering peeling tape to an adhesive sheet while maintaining a pressing amount or pressing force at a predetermined value according to thickness of an adherend etc., and having quick processing ability for peeling the peeling tape. SOLUTION: The sheet peeling device 10 is provided with: a holding means 11 of a semiconductor wafer W to which the adhesive sheet S has been adhered; a feeding-out means 13 for feeding-out the peeling tape PT; a pressing means 15 for pressing and adhering the peeling tape PT at an outer edge part of the adhesive sheet S; a peeling means 16 for peeling the adhesive sheet S from the semiconductor wafer W via the peeling tape PT; a control means 18 for controlling those means; and a storage means 19. An amount of back and forth movement of the pressing means 15 is controlled by the control means 18 based on thickness of each of the adhesive sheet S, the semiconductor wafer W, and the peeling tape PT stored in the storage means 19 via predetermined input operations. COPYRIGHT: (C)2010,JPO&INPIT |
