| 摘要 |
PROBLEM TO BE SOLVED: To achieve a pickup apparatus of a semiconductor chip and a pickup method of the semiconductor chip, in which dust attached to a semiconductor chip can be efficiently removed without increasing the number of processes. SOLUTION: The pickup apparatus 10 is provided with a collet 11 which is composed by forming an absorption part 11a which absorbs and fixes a semiconductor chip 22c and a cover part 11b is formed so as to cover at least a part in a thickness direction over all around a torn surface of 22m. A clearance 25 is formed between the torn surfaces of 22m of semiconductor chip 22c and the cover part 11b. Thereby, air flow W which flows into a suction device 12 can be generated. Dust P can be desorbed from the torn surfaces of 22m by the air flow W and can be sucked and removed by a suction device 12. Then, the semiconductor chip 22c is absorbed and fixed in the absorption part 11a, and the removal of the dust P and the pickup of the semiconductor chip 22c can be performed in the same process. COPYRIGHT: (C)2010,JPO&INPIT |
