| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can be reduced in size while variation in shape among circuit patterns is reduced. <P>SOLUTION: The semiconductor device 10 includes multiple circuit patterns 140 and first dummy patterns 142. The multiple circuit patterns 140 are disposed at regular intervals, and are used as part of the circuit. The multiple circuit patterns 140 consist of two outermost circuit patterns 140b and the other circuit patterns 140a. The first dummy patterns 142 are disposed on outer sides of the two outermost circuit patterns 140b, respectively. The distance between each of the outermost circuit patterns 140b and the corresponding first dummy pattern 142 is equal to a disposed distance between the circuit patterns 140. A width W<SB>2</SB>of each of the first dummy patterns 142 is smaller than a width W<SB>1</SB>of any of the circuit patterns 140, and is equal to a minimum design rule width, for example. <P>COPYRIGHT: (C)2010,JPO&INPIT |
