METHOD FOR REGENERATING ETCHING SOLUTION FOR COPPER AND COPPER ALLOY

摘要

PROBLEM TO BE SOLVED: To provide a regenerating method for an iron chloride (III) etching solution for copper and copper alloy by which an etching rate stable for a long time can be obtained while a volume of the discharged etching solution is minimized. Ž

SOLUTION: The etching solution is regenerated by incorporating an anion, which does not form a nonaqueous salt with Fe2+and Fe3+and forms a nonaqueous salt with Cu2+, into the iron chloride (III) etching solution and by a regeneration method including three steps of a separation step, an oxidation step, and an anion replenishment step. Ž

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