| 发明名称 |
Interconnect packaging systems |
| 摘要 |
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips. |
| 申请公布号 |
US7608919(B1) |
申请公布日期 |
2009.10.27 |
| 申请号 |
US20060599257 |
申请日期 |
2006.11.15 |
| 申请人 |
UNIVERSITY OF NOTRE DAME DU LAC |
发明人 |
BERNSTEIN GARY H.;FAY PATRICK;POROD WOLFGANG;LIU QING |
| 分类号 |
H01L23/02;H01L23/34;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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